Marketing Chen
Marketing Cai
Silicon nitride (Si₃N₄) membrane windows are widely used in semiconductors, electron microscopy, MEMS, optics, and new energy applications due to their excellent mechanical strength, chemical stability, and optical transparency (particularly in UV to near-infrared wavelengths). Based on application scenarios, structural design, and functional requirements, the product classification is as follows:
1. Classification by Substrate Material
Type | Characteristics | Typical Applications |
Silicon-based Si₃N₄ windows | Use silicon wafers as substrates, with suspended membranes formed by backside etching. Mature process, cost-effective. | TEM sample support, MEMS pressure sensors, X-ray masks |
Quartz/Glass-based Si₃N₄ windows | Better optical transparency, high-temperature resistance, but slightly lower mechanical strength than silicon-based. | Optical devices, UV sensors, microfluidic chips |
Metal-framed Si₃N₄ windows | Si₃N₄ membranes integrated into metal rings (e.g., Cu, Ti) for easy mounting and sealing. | TEM grids, vacuum device windows |
2. Classification by Membrane Structure
Type | Characteristics | Typical Applications |
Single-layer Si₃N₄ windows | Simple structure with a single Si₃N₄ layer (typically 50–500 nm thick). | Conventional TEM imaging, optical filters |
Multilayer composite windows | Alternating layers of Si₃N₄ with SiO₂, Al₂O₃, etc., for optimized stress or optical properties. | Anti-reflection coatings, high-stability MEMS devices |
Patterned Si₃N₄ windows | Micro/nanostructures (e.g., hole arrays, gratings) fabricated via lithography and etching. | Photonic crystals, diffractive optical elements |
3. Classification by Application Field
(1) Electron Microscopy (TEM/SEM)
Standard TEM grids: 3 mm diameter, Si₃N₄ membrane thickness 50–200 nm, for high-resolution imaging.
Ultra-thin windows (<50 nm): Minimize electron scattering for atomic-scale resolution (e.g., 2D materials).
Cryo-EM windows: Low-stress membranes compatible with cryogenic sample preparation.
(2) Semiconductors & MEMS
MEMS pressure sensor windows: Corrosion-resistant membranes for gas/chemical sensing.
X-ray lithography masks: Thick (~1 μm) Si₃N₄ layers for X-ray blocking and pattern definition.
(3) Optics & Optoelectronics
UV/IR transmission windows: Leverage Si₃N₄’s high UV transparency (e.g., DUV optical systems).
Laser protection windows: Laser-damage-resistant coatings for high-power laser devices.
(4) New Energy & Packaging
Battery observation windows: Electrolyte-resistant membranes for in situ battery reaction studies.
Vacuum sealing windows: High hermeticity Si₃N₄ films for maintaining vacuum/inert environments.
4. Technological Trends
Ultra-low-stress membranes: Optimized LPCVD processes to minimize warpage.
Large-area windows: For wafer-level packaging or large-scale optical devices.
Smart integration: Functionalized windows with heating/electrodes for in situ experiments.
The product classification of Si₃N₄ membrane windows is highly application-driven, with growing potential in advanced semiconductor packaging, quantum devices, and in situ characterization.
| Phone: 0512-67266051 |
| E-mail: sales@ywmems.com |
| Address: G202, No.338 Ruoshui Road,Suzhou Industrial Park, Jiangsu, China |
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